The IMAPS Italy Workshop on Photonic Packaging will take place on November 4–5, 2025, at the Politecnico di Milano – Bovisa campus. The event brings together leading experts, researchers, and industry professionals to explore the latest advancements in photonics integration, microsystems, and packaging technologies driving innovation in data centers, quantum photonics, and high-performance computing.
Through insightful presentations from international speakers, the workshop highlights cutting-edge developments in laser bonding, glass substrates, optical PCBs, and co-packaged optics. It provides a unique platform for knowledge exchange, networking, and technological inspiration in the heart of Milan.