HiTEN 2024

High Temperature Electronics Network

The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the world. All styles of practical high temperature electronics design and implementation approaches are encouraged, along with a variety of high temperature application areas. Today the main semiconductor focus of HITEN is silicon and silicon on insulator (SOI). Although, HITEN is not simply a semiconductor focused network. HITEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.

Abstracts are being requested in the following areas:

*Abstracts are being requested in the following areas:*
Applications in the Aerospace, Automotive, Oil & Gas, and Geothermal Industries Devices and applications Novel devices ASICs Memories Passive components Power devices MEMS Devices Sensors	Contacts and metallizations Semiconductor materials Materials and Process Packaging and interconnects Sealants, adhesives, solders Reliability and failure mechanisms Lifetime predictions Accelerated life testing Testing Packaging for Other Extreme Environments

Those wishing to present and publish a paper at the HiTEN 2024 Conference must submit a ~500 word abstract electronically on/before February 16, 2024, using the on-line submittal form at: www.imaps.org/hiten. All abstracts submitted should represent original, previously unpublished work. All speakers are required to pay a reduced registration fee. If your abstract is selected, you will be asked to follow the speaker timeline: – Speaker Acceptance Email (April 1, 2024); – Final Manuscript due for Proceedings (June 1, 2024); – Speaker Registration complete (June 1, 2024); – BIO Submitted (July 1, 2024); Slides/Presentation for session presentation (on/before July 17, 2024); and – Slides/Presentation file to distribute to registrants post-conference (on/before July 25, 2024).