HITEN 2022

The HITEN Conference Series has run successfully for over 20 years and is co-chaired by Colin Johnston of Oxford University and Patrick McCluskey of the University of Maryland in the United States. It is organised through IMAPS–US, with support from IMAPS-UK and has a dedicated website event page—www.imaps.org/hiten. It will be held this year in St Annes College, Oxford from 18-20 July 2022.

The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the world. Although HITEN is not simply a semiconductor focused network. HITEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.

Abstracts are requested in the following areas:

• Industrial Applications
• Devices and Applications
• Novel Devices
• ASICs
• Memories
• Passive Components
• Power Devices
• MEMS Devices
• Sensors
• Contacts and Metallisations
• Semiconductor Materials
• Materials
• Packaging and Interconnects
• Sealants, Adhesives, Solders
• Reliability and Failure Mechanisms
• Lifetime Predictions
• Accelerated Life Testing
• Testing

Those wishing to present and publish a paper at the HiTEN 2022 Conference must submit a ~500 word abstract electronically before 2nd March 2022, using the on-line submittal form at: www.imaps.org/hiten.