EMPC 2027

The European Microelectronics and Packaging Conference (EMPC 2027) will take place in Ingolstadt from September 14th to 16th, 2027. In addition, short courses will be offered on the day before, September 13th.

EMPC is the premier international conference for microelectronics packaging, owned and sponsored by IMAPS-Europe and co-sponsored by IEEE-EPS. The conference program will focus on industrial needs and trends and on academic long-term solutions. The event brings together researchers, innovators, technologists, business and marketing managers with an interest in semiconductor packaging.

Ingolstadt is nestled along the banks of the Danube River and offers the perfect blend of historical charm and modern convenience. Located in the heart of Bavaria, the city is easily accessible via excellent road and rail connections, as well as through nearby airports in Munich and Nuremberg.

Ingolstadt is rich in history, home to one of Germany’s oldest universities and famous as the birthplace of the Illuminati. Visitors can explore a variety of cultural and architectural landmarks, from the impressive medieval fortress, the New Castle (Neues Schloss), to the cutting-edge exhibits at the Audi Forum.

Whether you’re wandering the historic old town, enjoying local cuisine, or exploring its dynamic industry and research hubs, Ingolstadt is a city that inspires and connects — the ideal setting for the EMPC 2027.