The 24th European Microelectronics Packaging Conference (EMPC 2023) will return to the United Kingdom after 12 years and will be hosted at the Genome Centre in Hinxton, near Cambridge from 11 – 14th September 2023. The website provides some initial information on the Conference, including:
You will attend presentations and posters from leading companies and academic institutions on emerging trends in electronics devices and associated technology. The event will introduce new materials and opportunities in the packaging of electronic devices and potential applications of systems. We are planning that EMPC 2023 will be run as a face to face event, enabling attendees and exhibitors to network personally in the spacious surrounds of the Genome Centre.
Abstracts should not exceed 500 words and can only be submitted as pdf, not in Word or other format. Authors who are submitting more than one abstracts should make a separate submission for each. A template for the abstract will be provided.
Are you interested in becoming an exhibitor or sponsor? You will have the unique opportunity to market your products and services to a captive audience of buyers, designers, and influential researchers. Our opening hours are arranged to give exhibitors maximum exposure, and social events are planned in the exhibition space to encourage all delegates to meet and mingle formally and informally. FInd out more information on our website: EMPC 2023 | The 24th European Microelectronics & Packaging Conference and Exhibition.