Additive Manufacturing for Microelectronics II Edition

The conference will be held in English language in presence, for up to 100 people.
Access is free and subject to availability, mandatory registration at the following link:
https ://www.imaps -italy.it/in-primo-piano/7-november-2023-additive-manufacturing.html

Programme

09:00 Welcome and Introduction IMAPS Italy
09:10 AME – The Next Level of Electronics Manufacturing
Alexandre Schäfer, J .A.M.E.S GmbH – Germany
Ryojiro Tominaga, FUJ I CORPORATION – Japan
10:00 Pushing the Boundaries of Additive Manufacturing with Ultra-Precise Deposition (UPD)
Łukas z Kos ior, XTPL – Poland
10:25 Introducing HPCAP, an innovative AFM-based printing technology
Marc Pascual, Hummink – France
10:50 Coffee Break
11:20 Fabrication of micro-sized thermoelectric legs by laser-induced forward transfer
Matteo d’Angelo, Dario Crimella, Ali Gökhan Demir and Nora Leci s , Politecnico di Milano – Italy
11:45 High-Performance Organic Electrochemical Transistors Manufactured with Micro-Dispensing
Fabri z io Torricelli, Univer s ity of Brescia – Brescia, Italy
12:10 3D printed micro-coolers for power electronics
Thomas Ebert, IQ evolution GmbH – Germany
12:35 Aligned 2-Photon Lithography
Mareike Trappen, Nanoscribe GmbH & Co. – Germany
13:00 Lunch
14:15 3D Printing of Silica Glass with Sub-Micrometer Resolution
Po-Han Huang, KTH Royal Ins titute of Technology – Sweden
14:40 Beyond Fine Pitch: 3D Microprinted Probes for <20 μm Pitch Probe Testing
Edward White, Exaddon – Swit zerland
15:05 Inkjet Printing and Aerosol Jet Printing of Polymers for Wafer Bonding Applications
Filippo Iervolino, Politecnico di Milano – Italy
15:30 Coffee Break
16:00 Mass production of Optical Sub Assembling with RMPD
Reiner Goet zen, microTEC Gesell schaft für Mikrotechnologie mbH – Germany
16:25 Capacitive inertial MEMS fabricated through additive manufacturing ink-jet process
Giorgio De Pasquale, Politecnico di Torino – Italy
16:50 Printed CMOS Integrated Circuits: towards pervasive smart electronics systems
Andrea Perinot, FLEEP Technologies S.r.l. – Italy
17:15 Closing Remarks