EMPC 2027

The European Microelectronics and Packaging Conference (EMPC 2027) is the premier international conference for microelectronics packaging, owned and sponsored by IMAPS-Europe and co-sponsored by IEEE-EPS. The conference program will focus on industrial needs and trends and on academic long-term solutions. The event brings together researchers, innovators, technologists, business and marketing managers with an interest in semiconductor packaging.

The conference will take place in Ingolstadt from September 14th to 16th, 2027. In addition, short courses will be offered on the day before, September 13th.