EBL 2024
From March 5 to 6, 2024, the 12th DVS/GMM Symposium will open its doors in the Schwabenhalle Fellbach. Visitors can expect current lectures on the topic of “Electronic assemblies and printed circuit boards – sustainability and energy efficiency with smart electronics”, which will be accompanied by an exhibition from various companies and associations. IMAPS Deutschland e.V. is also supporting this event with numerous specialist presentations and various members who will be presenting their products and services to the specialist audience during the accompanying exhibition.
Conference topics
The foundations of artificial intelligence were developed back in the 1940s and 50s. The fact that we are experiencing a hype about AI topics today is mainly due to the fact that it is only in recent years that technological development has enabled meaningful and efficient application and business models have developed from this.
The main prerequisites were the chip and module technology required for smart electronics, as well as the software and system environment for application and implementation. However, it is not only the technologies that have evolved, but also society and global requirements. Today, it is more important than ever for humanity to use our limited resources efficiently and sustainably. The development and application of smart electronics plays a key role in this. For example, advances in power electronics, which are crucial for the energy transition, would not be efficient without intelligent adaptation of the various components of energy systems. But the production of electronics itself must also become more sustainable and energy-efficient, which also requires smart electronics. Building on the concepts of Industry 4.0, a new quality can be achieved today through machine learning and intelligent data processing, which can be mapped holistically in the “digital transformation”. Electronic assemblies are both a means to an end and the object of these developments.
The EBL 2024 conference aims to contribute to this, stimulate discussion and thus take account of the important position of our industry in this field.
The main topics of the conference will be:
- Digitalization, Industry 4.0, machine learning, AI
- Intelligent system concepts, design tools, tests and simulation
- New materials
- Energy efficiency
- Functional and circuit carriers
- Module and assembly production
- AVT, soft soldering, bonding, sintering, bonding, lasers
- Process simulation and controlTraceability, compliance, product and process safety
- Test methods, reliability and analytics
- Trends, sustainability, flexible manufacturing processes