IMAPS-Italy Workshop

This IMAPS-Italy workshop will include the following topics:

• Technological trends and challenges,Davide Tarsitano, Politecnico di Milano
• Salvatore COFFA, R&D General Manager Power & Discrete  STMicroelectronics
• Concepts for realizing High-Voltage Power Modules by Embedding of SiC Semiconductors, Lars Boettcher, Fraunhofer IZM, Berlin

• AQG 324 Qualification Guidelines,  Thomas Harder, European Center for Power Electronics (ECPE)

Afternoon Tutorials

•   ECPE-Tutorial on ´Packaging of Wide Band Gap Devices´  Parts 1 & 2

Andreas Schletz, Head of Department Packaging & Reliability at Fraunhofer Institute IISB, Erlangen

The full program can be found here. For further information please contact: info@imaps-italy.it