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Who We Are...

The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education and training, interaction with industry and networking amongst professionals and academics.

Founded in 1967, IMAPS is the leading international microelectronics and electronics packaging society with professional members in 23 North American chapters and 21 international chapters. Microelectronics Foundation provides annual grants to students involved in electronics packaging disciplines.

IMAPS-Europe comprises eleven IMAPS Chapters. The members of the chapters embrace the community of microelectronics packaging engineers throughout Europe. contains news, events, committee information, member directories. The IMAPS European chapters are the independent local Chapters of IMAPS throughout Europe. Their members number over 1000 individuals plus additional corporate members in some chapters. Membership is always local to a chapter. The Chapters are listed on next page. The IMAPS European chapters organize national and international seminars, workshops and conferences.

The flagship event being the EMPC, which is held every odd year interleaved with ESTC every even year with mutual access to both events

Upcoming Events:

RF and Microwave Packaging Workshop

RF and Microwave Packaging Workshop

April 26 – 27, 2017
Espace Saint-Martin Conference Center, Paris, France

For this year’s RF and Microwave Packaging Workshop, we are happy to welcome you to the heart of Paris. Here you will have to be part of a unique forum that brings together scientists, engineers, manufacturing, academia and business people from around the world.

The workshop enables discussions and presentations about the latest technology in the field of RF and Microwave packaging. This will also be the first joint workshop between IMAPS NA and IMAPS France. The workshop will take place in the Espace Saint-Martin conference centre, which gives you a chance to enjoy the most beautiful parts of Paris.

We are very looking forward to receiving your abstracts until January 31, 2017. Subjects range from emerging technologies, new design/ materials, new applications to current technology. More information on the topics and how to submit your abstract can be found under See you at RaMP!

Abstract deadline: January 31, 2017

Abstract submission:

More information:

MiNaPAD Forum 2017

MiNaPAD Forum 2017

After the ESTC 2016 and the SEMICON in October, the MiNaPAD Forum will be the next to be hosted in Grenoble. Taking place from May 17 - 18, there will be plenty of opportunity to discuss Micro/ Nano-Electronics Packaging and Assembly, Design and Manufacturing in the World Trade Center of Grenoble. IMAPS France looks forward to meeting you there. Location: World Trade Center Grenoble, France

17 - 18 May 2017

Event Calendar

iMAPS Nordic Conference 2017

Nordic Conference on Microelectronics Packaging, NordPac

in technical co-sponsorship with IEEE CPMT

18th – 20th June 2017, Läppstiftet Conference Center, Gothenburg, Sweden

The IMAPS Nordic Conference on Microelectronics Packaging (NordPac) will be held 18th – 20th June 2017 in Gothenburg, Sweden. This is first time that IMAPS Nordic Chapter and IEEE CPMT Nordic Chapter jointly organise this event. The event brings together both academics as well as industry leaders to discuss and debate the state-of-the-art and future trends in microelectronics components, packaging, integration and manufacturing technologies. NordPac provides a perfect opportunity to hear the latest news and developments in the field. So mark the dates in your calendar today!

Download Call for Exhibitors

Location: Läppstiftet Conference Center, Gothenburg, Sweden



Event Calendar

EMPC 2017

EMPC 2017 - Call for papers now available

With well over 300 participants EMPC - together with its bi-annual co-conference ESTC - has established itself as the trade event in Europe for microelectronic packaging. Next year’s EMPC will be held at the University of Warsaw from September 10-13, 2017 and as organizers the Polish IMAPS Chapter cordially invites you to join them as a presenter, visitor, exhibitor or sponsor.

Abstracts should cover at least one of the following technical topics:

  • Advanced packaging and interconnects
  • Electronics components assembly and PCB solutions
  • Materials and processes
  • Printed, hybrid and flexible electronics
  • Modeling, design test & reliability
  • Functional systems (actuators, sensors, photovoltaics and related)

Authors are invited to submit a 200–300 word abstract through the online conference system, along with a short ‘author biography’ and a photograph. Please visit to set up an account and upload your abstract. The deadline for abstract submission is March 31, 2017.

Event Calendar

IMAPS US 2017 - Raleigh

IMAPS US 2017 - Raleigh

The 50th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2017 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The Symposium will feature 5 technical tracks and an Interactive Poster Session.

10-12 Oktober, 2017

Abstract submission deadline: February 15, 2017

Download Call for Papers

More information:

Important Info

IMAPS honors Martin Schneider-Ramelow with Fellow of the Society Award

For his years of dedication and support in various leadership roles Martin Schneider-Ramelow was honored as a Fellow of the International Microelectronics Assembly and Packaging Society (IMAPS) during the 49th International Symposium on Microelectronics that took place in Pasadena, USA, from Oct. 10 - 14, 2016. read more

Why become a member?

Member to member exchange

Expand your contacts

Events & Proceedings

Advancing Microelectronics

Affiliated Membership IMAPS NA

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