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Who We Are...

The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education and training, interaction with industry and networking amongst professionals and academics.

Founded in 1967, IMAPS is the leading international microelectronics and electronics packaging society with professional members in 23 North American chapters and 21 international chapters. Microelectronics Foundation provides annual grants to students involved in electronics packaging disciplines.

IMAPS-Europe comprises eleven IMAPS Chapters. The members of the chapters embrace the community of microelectronics packaging engineers throughout Europe. contains news, events, committee information, member directories. The IMAPS European chapters are the independent local Chapters of IMAPS throughout Europe. Their members number over 1000 individuals plus additional corporate members in some chapters. Membership is always local to a chapter. The Chapters are listed on next page. The IMAPS European chapters organize national and international seminars, workshops and conferences.

The flagship event being the EMPC, which is held every odd year interleaved with ESTC every even year with mutual access to both events

Upcoming Events:

MicroTech 2018

„MOORE THAN PACKAGING: 50 Years Gone, 50 Years On“ – this motto will lead you through the 50 year celebration of IMAPS UK, or more precisely the ISHM (The International Society for Hybrid Microelectronics) which was the forerunner of IMAPS as we know it today. Join this special event for Gala Awards and a Networking Dinner on April 9. It will be continued with the Society’s Annual Conference on April 10 at the prestigious Royal Holloway Windsor Conference Center in Egham, UK. Sessions will follow the above mentioned theme and therefore cover subjects like Process and Technologies, Applications and Trends. You can look forward to a Panel Session discussing the future direction, challenges and technologies our industry faces.

April 9-10, 2018

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CICMT 2018

The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) 2018 is hosted by the University of Aveiro, Portugal and The American Ceramic Society. From April 18 – 20, 2018 we look forward to international presentations on the latest ceramic technology and future system directions. There will also be a focused exhibition for suppliers who support the use of the technologies. Student participation will be promoted throughout a technical poster session, which, next to various social events, promotes new contacts. We are looking forward to your abstracts and to meeting you at CICMT at Aveiro University!

April 18 – 20, 2018

Deadline on abstract submission: November 30, 2017

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HITEC 2018

IMAPS North America invites you to High Temperature Electronics (HiTEC) 2018, taking place at Hotel Albuquerque in Albuquerque (New Mexico, USA). Join in to experience leading high temperature electronics research results and application requirements. Networking in a relaxed atmosphere with colleagues from around the world cannot be missed either. For more information on subjects for papers please refer to the link below. We look forward to meeting you at HiTEC 2018!

May 8 – 10, 2018

Deadline on abstract submission: January 22, 2018

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NordPac 2018

June 12 – 14, 2018 at VTT, Oulu, Finland

The 2018 NordPac conference will be held in Finland from June 12-14, 2018. The event brand NordPac was introduced in Gothenburg in 2017 as a collaboration between IMAPS Nordic and IEEE EPS Nordic. The conference will take place at VTT Technical Research Centre of Finland Ltd in Oulu. Please see for details.

Authors are welcome to submit an abstract and suggestion for a paper to the NordPac Conference 2018. The abstract must be non-commercial and submitted in electronic form to no later than March 20, 2018. Speakers will be notified of paper acceptance by email by April 20.

Download Call for Papers

DPC 2018

WekoPa Resort and Casino, Fountain Hills, Arizona USA

March 5-8, 2018

The 14th Annual Device Packaging Conference (DPC 2018) will be held in Fountain Hills, Arizona, on March 5-8, 2018. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

Early registration deadline: February 1, 2018

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51st International Symposium on Microelectronics

Pasadena Convention Center, California, USA

October 8-10, 2018

The 51st International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2018 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The Symposium will feature 5 technical tracks, plus our Interactive Poster Session, that span the three days of sessions.

Abstracts Due: January 31, 2018

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EMPC 2019

From September 16 - 19, 2019, IMAPS Italy will welcome you to the charming tuscan city of Pisa, but also one with a background in high tech.

A wide range of technological topics from the microelectronics field will be covered during this major conference. Included are e.g. power packaging, photonics, sensor packaging and bio-medical, automotive and aerospace/defense electronics.

Join this conference for its 22nd edition to get together and network with representatives from industry and academia.

September 16 - 19, 2019

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Important Info

Klaus Dieter Lang receives the William D. Ashman Achievement Award

The International Microelectronics Assembly and Packaging Society (IMAPS) awards the William D. Ashman Achievement Award once every year to an individual who has made significant technical contributions to the electronics packaging industry.

The 2016 William D. Ashman Achievement Award was awarded to Prof. Dr. Dr. Klaus Dieter-Lang for his exceptional contribution to the development of electronic packaging for advanced system-integration. This prestigious award was handed over to Prof. Lang by IMAPS President, Susan Trulli, on October 10, 2017 during the award presentation ceremony at the 50th International Symposium on Microelectronics in Raleigh, NC, USA.

IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies worldwide. Prof. Lang has been the director of Fraunhofer IZM since 2011. He is a Fellow, and Life Member of IMAPS, as well as a Senior Member of IEEE. read More

Polish IMAPS Chapter successfully hosted first EMPC Conference in Eastern Europe

From September, 10 - 13, 2017 the Polish IMAPS chapter hosted the European Microelectronic Packaging Conference (EMPC) in the beautiful rooms of the Technical University of Warsaw. With 3 tracks and 72 oral and 25 poster presentations it was a truly immersive experience for the 250 conference delegates participating. 

The organisers were particularly pleased by the variety of conference participants. Attendees came from 20 different countries and in almost equal parts from both industry and academia, and based on the networking observed on the conference floor and at the social events, it seems everyone went home with new contacts, insights and inspiration.

A particular highlight of the event was the conference dinner which took place in the big hall of the Physics Department on Tuesday. Live music and good food were an excellent backdrop for catching up with colleagues and some delegates even ventured out onto the dance floor.

The Best Paper winner was Fabrice F. C. Duval with his paper about "Impact of the combination of a stress buffer layer and a wafer level underfill on 3D IC assembly using thermal compression bonding". The Best Poster Award went to Yongyin Kim and his co-authors for their paper on „Fabrication of dry-patching superhydrophobic flexible platform for HySiF (hybrid system in flexible) applications”. Our congratulations go to both teams – well done, everybody.

The next EMPC Conference will be hosted by the Italian IMAPS chapter from September 16 - 19, 2019, in the lovely city of Pisa. More information can be found at: 

Last, the organisers would like to extend our thanks to all keynote speakers, presenters, session chairs, committee members, exhibitors, sponsors and our organizing team for the part they played in this truly memorable event. 

Why become a member?

Member to member exchange

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Events & Proceedings

Advancing Microelectronics

Affiliated Membership IMAPS NA

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