The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education and training, interaction with industry and networking amongst professionals and academics.
Founded in 1967, IMAPS is the leading international microelectronics and electronics packaging society with professional members in 23 North American chapters and 21 international chapters. Microelectronics Foundation provides annual grants to students involved in electronics packaging disciplines.
IMAPS-Europe comprises eleven IMAPS Chapters. The members of the chapters embrace the community of microelectronics packaging engineers throughout Europe. www.imapseurope.org contains news, events, committee information, member directories. The IMAPS European chapters are the independent local Chapters of IMAPS throughout Europe. Their members number over 1000 individuals plus additional corporate members in some chapters. Membership is always local to a chapter. The Chapters are listed on next page. The IMAPS European chapters organize national and international seminars, workshops and conferences.
The flagship event being the EMPC, which is held every odd year interleaved with ESTC every even year with mutual access to both events
Organised by iMAPS CZ & SK in cooperation with CEITEC, the flash conference will be thematically focused on areas that are related to the scope of the organizing company interst, i.e. Microelectronics Assembly, Packaging & 3D Structures, Soldering & Chip attachment, Simulation & Testing as well as Sensors & Nano structures.
We look forward to meeting you in Brno!
3 – 4 November 2016
Location: Brno University of Technology, Czech Republic
Organized by IEEE-CPMT since 2006, the Electronics System-Integration Technology Conferences (ESTC) series is the premier venue for academics and industry to present and discuss the latest developments in assembly and interconnection technology and new applications. The next ESTC will be taking place in Grenoble in September 2016.
Location: Grenoble, France
Under the theme "Advanced Packaging & Technology Trends" IMAPS-UK's MicroTech annual conference will bring together the entire microelectronics supply chain and is the only UK event dedicated to Micro-Assembly and related technologies.
Being held in the prestigious Rutherford Appleton Laboratory (RAL) in Didcot, the event will feature invited Keynote talks, technical presentations and table top exhibits on the latest developments, technologies and capabilities. The high-impact session and poster displays will inform you about the latest UK research.
16 March 2017
After the ESTC 2016 and the SEMICON in October, the MiNaPAD Forum will be the next to be hosted in Grenoble. Taking place from May 17 - 18, there will be plenty of opportunity to discuss Micro/ Nano-Electronics Packaging and Assembly, Design and Manufacturing in the World Trade Center of Grenoble. IMAPS France looks forward to meeting you there. Location: World Trade Center Grenoble, France
17 - 18 May 2017
For more information about the next Nordic conference, please stay tuned!
Location: Gothenburg, Sweden
IMAPS Polen und die Universität Wartschau laden gemeinsam zur nächsten European Microelectronic Packaging Conference EMPC 2017 nach Warschau. Neben der Konferenz wird ein weiteres Highlight die begleitende Ausstellung mit internationalen Unternehmen und Forschungseinrichtungen aus dem Bereich der Aufbau- und Verbindungstechnik sein.
10 - 13 September 2017
Location: Warsaw, Polen