The European Microelectronics and Packaging Conference (EMPC) is the established international forum for engineers working in the field and others wanting to learn from this leading event.
EMPC 2019 in Pisa will offer the best of microelectronics packaging and interconnection technologies, providing top quality coverage of technological innovation in this field. A wide range of topics from microelectronics will be covered during this major conference. Included are e.g. power packaging, photonics, sensor packaging and bio-medical, automotive and aerospace/defense electronics.
Join this conference for its 22nd edition to get together and network with representatives from industry and academia.
The four days will comprise Tutorials/Short Courses and the Conference and Exhibition during 16th to 19th September at the Palazzo Dei Congressi, an ideal venue which includes excellent lecture auditoria, exhibition space and a great social venue. The event will be complemented by social events for which IMAPS has a great tradition.
Pisa where tradition, art, culture and business meet harmoniously is ideally located also to extend your visit in Italy.