International Microelectronics and Packaging Society Europe
International Microelectronics and Packaging Society Europe
International Microelectronics and Packaging Society Europe
International Microelectronics and Packaging Society Europe
International Microelectronics and Packaging Society Europe
International Microelectronics and Packaging Society Europe
International Microelectronics and Packaging Society Europe
UK, 11-14 September 2023 With 5 keynotes, 4 short courses, 69 oral presentations in 20 sessions and 18 posters, EMPC 2023 provided an exciting and diverse […]
The 56th International Symposium on Microelectronics (IMAPS 2023) took place in San Diego, California, this year, attracting nearly 800 participants from around the world. In keynote […]
With the approval of the Fraunhofer-Gesellschaft’s Scientific and Technical Council Prof. Martin Schneider-Ramelow, the president of IMAPS Germany, has received and accepted the call to be […]