adress Kleingrötzing 1 • D-84494 Neumarkt-St. Veit

call +49 (8722) 9620-0

mail info{@}imaps.de

Who We Are...

The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education and training, interaction with industry and networking amongst professionals and academics.

Founded in 1967, IMAPS is the leading international microelectronics and electronics packaging society with professional members in 23 North American chapters and 21 international chapters. Microelectronics Foundation provides annual grants to students involved in electronics packaging disciplines.

IMAPS-Europe comprises eleven IMAPS Chapters. The members of the chapters embrace the community of microelectronics packaging engineers throughout Europe. www.imapseurope.org contains news, events, committee information, member directories. The IMAPS European chapters are the independent local Chapters of IMAPS throughout Europe. Their members number over 1000 individuals plus additional corporate members in some chapters. Membership is always local to a chapter. The Chapters are listed on next page. The IMAPS European chapters organize national and international seminars, workshops and conferences.

The flagship event being the EMPC, which is held every odd year interleaved with ESTC every even year with mutual access to both events

Upcoming Events:

51st ISoM

Pasadena Convention Center, California, USA

October 8-10, 2018

The 51st International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2018 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The Symposium will feature 5 technical tracks, plus our Interactive Poster Session, that span the three days of sessions.

Abstracts Due: January 31, 2018

More Info: http://www.imaps.org/imaps2018/

ESTC 2018

September 18-21, 2018

Organized by IEEE-EPS (former CPMT) since 2006, the Electronics System-Integration Technology Conferences (ESTC) series is the premier venue for academics and industry to present and discuss the latest developments in assembly and interconnection technology and new applications.

More Info: https://www.estc-conference.net/

EMPC 2019

From September 16 - 19, 2019, IMAPS Italy will welcome you to the charming tuscan city of Pisa, but also one with a background in high tech.

A wide range of technological topics from the microelectronics field will be covered during this major conference. Included are e.g. power packaging, photonics, sensor packaging and bio-medical, automotive and aerospace/defense electronics.

Join this conference for its 22nd edition to get together and network with representatives from industry and academia.

September 16 - 19, 2019

Download Call for abstracts (.pdf)

More information

Important Info

22nd Microelectronics an Packaging Conference (EMPC) & Exhibition

The European Microelectronics and Packaging Conference (EMPC) is the established international forum for engineers working in the field and others wanting to learn from this leading event.

EMPC-2019 in Pisa offers the best of microelectronics packaging and interconnection technologies, providing top quality coverage of technological innovation in this field. The four days will comprise Tutorials/Short Courses and the Conference and Exhibition during 16th to 19th September at the Palazzo Dei Congressi, an ideal venue which includes excellent lecture auditoria, exhibition space and a great social venue. The event will be complemented by social events for which IMAPS has a great tradition. See you in Pisa!

Download Call for abstracts (.pdf)

More information can be found here.

Polish IMAPS Chapter successfully hosted first EMPC Conference in Eastern Europe

From September, 10 - 13, 2017 the Polish IMAPS chapter hosted the European Microelectronic Packaging Conference (EMPC) in the beautiful rooms of the Technical University of Warsaw. With 3 tracks and 72 oral and 25 poster presentations it was a truly immersive experience for the 250 conference delegates participating. 

The organisers were particularly pleased by the variety of conference participants. Attendees came from 20 different countries and in almost equal parts from both industry and academia, and based on the networking observed on the conference floor and at the social events, it seems everyone went home with new contacts, insights and inspiration.

A particular highlight of the event was the conference dinner which took place in the big hall of the Physics Department on Tuesday. Live music and good food were an excellent backdrop for catching up with colleagues and some delegates even ventured out onto the dance floor.

The Best Paper winner was Fabrice F. C. Duval with his paper about "Impact of the combination of a stress buffer layer and a wafer level underfill on 3D IC assembly using thermal compression bonding". The Best Poster Award went to Yongyin Kim and his co-authors for their paper on „Fabrication of dry-patching superhydrophobic flexible platform for HySiF (hybrid system in flexible) applications”. Our congratulations go to both teams – well done, everybody.

The next EMPC Conference will be hosted by the Italian IMAPS chapter from September 16 - 19, 2019, in the lovely city of Pisa. More information can be found at: http://www.imaps-italy.it/in-primo-piano/empc-2019-italy.html 

Last, the organisers would like to extend our thanks to all keynote speakers, presenters, session chairs, committee members, exhibitors, sponsors and our organizing team for the part they played in this truly memorable event. 

Klaus Dieter Lang receives the William D. Ashman Achievement Award

The International Microelectronics Assembly and Packaging Society (IMAPS) awards the William D. Ashman Achievement Award once every year to an individual who has made significant technical contributions to the electronics packaging industry.

The 2016 William D. Ashman Achievement Award was awarded to Prof. Dr. Dr. Klaus Dieter-Lang for his exceptional contribution to the development of electronic packaging for advanced system-integration. This prestigious award was handed over to Prof. Lang by IMAPS President, Susan Trulli, on October 10, 2017 during the award presentation ceremony at the 50th International Symposium on Microelectronics in Raleigh, NC, USA.

IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies worldwide. Prof. Lang has been the director of Fraunhofer IZM since 2011. He is a Fellow, and Life Member of IMAPS, as well as a Senior Member of IEEE. read More

Why become a member?

Member to member exchange

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Events & Proceedings

Advancing Microelectronics

Affiliated Membership IMAPS NA

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