The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education and training, interaction with industry and networking amongst professionals and academics.
Founded in 1967, IMAPS is the leading international microelectronics and electronics packaging society with professional members in 23 North American chapters and 21 international chapters. Microelectronics Foundation provides annual grants to students involved in electronics packaging disciplines.
IMAPS-Europe comprises eleven IMAPS Chapters. The members of the chapters embrace the community of microelectronics packaging engineers throughout Europe. www.imapseurope.org contains news, events, committee information, member directories. The IMAPS European chapters are the independent local Chapters of IMAPS throughout Europe. Their members number over 1000 individuals plus additional corporate members in some chapters. Membership is always local to a chapter. The Chapters are listed on next page. The IMAPS European chapters organize national and international seminars, workshops and conferences.
The flagship event being the EMPC, which is held every odd year interleaved with ESTC every even year with mutual access to both events
„MOORE THAN PACKAGING: 50 Years Gone, 50 Years On“ – this motto will lead you through the 50 year celebration of IMAPS UK, or more precisely the ISHM (The International Society for Hybrid Microelectronics) which was the forerunner of IMAPS as we know it today. Join this special event for Gala Awards and a Networking Dinner on April 9. It will be continued with the Society’s Annual Conference on April 10 at the prestigious Royal Holloway Windsor Conference Center in Egham, UK. Sessions will follow the above mentioned theme and therefore cover subjects like Process and Technologies, Applications and Trends. You can look forward to a Panel Session discussing the future direction, challenges and technologies our industry faces.
April 9-10, 2018
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) 2018 is hosted by the University of Aveiro, Portugal and The American Ceramic Society. From April 18 – 20, 2018 we look forward to international presentations on the latest ceramic technology and future system directions. There will also be a focused exhibition for suppliers who support the use of the technologies. Student participation will be promoted throughout a technical poster session, which, next to various social events, promotes new contacts. We are looking forward to your abstracts and to meeting you at CICMT at Aveiro University!
April 18 – 20, 2018
Deadline on abstract submission: November 30, 2017
IMAPS North America invites you to High Temperature Electronics (HiTEC) 2018, taking place at Hotel Albuquerque in Albuquerque (New Mexico, USA). Join in to experience leading high temperature electronics research results and application requirements. Networking in a relaxed atmosphere with colleagues from around the world cannot be missed either. For more information on subjects for papers please refer to the link below. We look forward to meeting you at HiTEC 2018!
May 8 – 10, 2018
Deadline on abstract submission: January 22, 2018
June 12 – 14, 2018 at VTT, Oulu, Finland
The 2018 NordPac conference will be held in Finland from June 12-14, 2018. The event brand NordPac was introduced in Gothenburg in 2017 as a collaboration between IMAPS Nordic and IEEE EPS Nordic. The conference will take place at VTT Technical Research Centre of Finland Ltd in Oulu. Please see www.nordpac.org for details.
Authors are welcome to submit an abstract and suggestion for a paper to the NordPac Conference 2018. The abstract must be non-commercial and submitted in electronic form to firstname.lastname@example.org no later than March 20, 2018. Speakers will be notified of paper acceptance by email by April 20.
WekoPa Resort and Casino, Fountain Hills, Arizona USA
March 5-8, 2018
The 14th Annual Device Packaging Conference (DPC 2018) will be held in Fountain Hills, Arizona, on March 5-8, 2018. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.
Early registration deadline: February 1, 2018
More Info: www.imaps.org/devicepackaging
Pasadena Convention Center, California, USA
October 8-10, 2018
The 51st International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2018 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The Symposium will feature 5 technical tracks, plus our Interactive Poster Session, that span the three days of sessions.
Abstracts Due: January 31, 2018
More Info: http://www.imaps.org/imaps2018/
From September 16 - 19, 2019, IMAPS Italy will welcome you to the charming tuscan city of Pisa, but also one with a background in high tech.
A wide range of technological topics from the microelectronics field will be covered during this major conference. Included are e.g. power packaging, photonics, sensor packaging and bio-medical, automotive and aerospace/defense electronics.
Join this conference for its 22nd edition to get together and network with representatives from industry and academia.
September 16 - 19, 2019